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Made of high thermal-conductivity materials (aluminum: ≥200 W/m·K; copper: ≥400 W/m·K), they quickly transfer heat from components (e.g., CPUs, IGBTs). Optimized structures (fins, microchannels) boost heat exchange, while passive models handle 30–65W loads and active (fan-equipped) ones support ≥100W with low thermal resistance (down to 0.3 K/W).
Passive heat sinks have no moving parts, avoiding wear and needing little maintenance (service life ≥10 years). Active models use durable PWM fans (MTBF ≥50,000 hours) and tolerate extreme conditions (-40°C to +125°C, vibration, dust) without performance drops.
Passive designs produce 0 dB noise, ideal for quiet spaces. Active ones adjust fan speed via PWM: 30–40 dBA at low loads and only ramp up when needed.
Aluminum heat sinks use low-cost extrusion; copper-aluminum composites cut material costs. No coolant refills or frequent part replacements reduce long-term TCO (30–50% lower than liquid cooling over 5 years).
Available in sizes from 50×50×15mm (IoT modules) to 300×200×80mm (industrial units). Compatible with screws, adhesive, or standard sockets (e.g., Intel LGA1700), fitting diverse device designs.
Aluminum (95% recyclable) and copper (100% recyclable) reduce waste; many use 5–10% post-consumer recycled material. Meets RoHS/REACH standards, with low CO₂ emissions during production.
